GlobalFoundries wins $2bn TSMC interposer deal for US packaging

· Tech · United States · Taiwan

GlobalFoundries said on October 8, 2026 that it signed a multi-year, $2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS advanced packaging ecosystem. Production will take place at GlobalFoundries' Malta, New York fab, which the company says will become the first US-based source of silicon interposers supporting advanced packaging. CoWoS is a key technology for stacking AI accelerators with high-bandwidth memory, and capacity has been a persistent bottleneck for AI chip supply. The deal gives TSMC a domestic packaging partner and reduces reliance on overseas interposer supply, a priority for US chipmaking resilience.

Why it matters：Advanced packaging capacity has been the tightest link in AI chip supply; adding a US interposer source could ease bottlenecks and shift where the AI supply chain is anchored.

Key points

  • The multi-year agreement is valued at $2 billion.
  • Interposers will be made at GlobalFoundries' Malta, New York fab.
  • The site is billed as the first US source of interposers for advanced packaging.

Sources (original reporting)

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