Samsung chief visits Japan chip packaging lab

· Tech · South Korea · Japan

Samsung Electronics Executive Chairman Lee Jae-yong visited the company's Advanced Package Lab in Yokohama, Japan, on Sunday, emphasizing the need to secure cutting-edge packaging technologies to sharpen its competitive edge in AI chips. Lee reviewed work at the research facility, which focuses on advanced semiconductor packaging. Packaging has become a critical battleground in the AI chip race as demand grows for high-bandwidth memory and complex chip stacking.

Why it matters：Advanced packaging is a bottleneck in AI chip supply, making it a strategic priority for Samsung against rivals.

Key points

  • Lee visited the Advanced Package Lab in Yokohama
  • He stressed cutting-edge packaging for AI chips
  • Packaging is a key battleground in AI chip supply

Sources (original reporting)

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